Join Achronix at Booth 306: Explore the Future of FPGA-Powered Chiplet Technology

Event Start Date
Event End Date
Santa Clara Convention Center, 5001 Great America Pkwy, Santa Clara, CA 95054
Santa Clara

Santa Clara, California – February 6–8, 2024

Achronix, an innovator in high-performance FPGA and eFPGA IP technology, proudly co-sponsors the upcoming Chiplet Summit, a premier event showcasing the latest advancements in chiplet technology. From February 6 to 8, this summit provides attendees valuable insights into optimizing chiplet performance, scalability, power efficiency, and flexibility.

Set up a meeting with our team or stop by our booth to:

  • Develop eFPGA-powered chiplets with Achronix Speedcore™ eFPGA licensable fabric and 2D NoC, ensuring effortless chiplet integration that keeps your designs ahead in flexibility and performance.
  • Leverage Achronix chiplet solutions to future-proof your designs. These solutions support a wide range of processing nodes, from 16nm to cutting-edge 3nm TSMC, ensuring ongoing innovation and superior performance.
  • Experience seamless connectivity by harnessing the power of eFPGA IP for unparalleled die-to-die interface flexibility and robust protocol support, empowering your designs with limitless connectivity options.

Meet with an Achronix Chiplet Expert at Booth #306

Join us at booth 306 to discover the benefits of our eFPGA-powered chiplets, including:

  • Licensable fabric and 2D NoC for seamless chiplet integration
  • Interface IP supporting industry-standard D2D connectivity
  • Advanced process technology support for cutting-edge designs
  • Flexible low-power, low-latency protocol support for optimal performance

Conference Sessions

  • Multiple Presentation Series: Flexible eFPGA-Based Demonstration Platform for Die-to-Die Interface Testing, Nick Ilyadis to present in partnership with Andy Heinig, Fraunhofer IIS/EAS | Feb 6 | ~9:00 – 9:30 am PST (2nd Presentation)
  • Superpanel: How Can Chiplets Accelerate Generative AI Applications? | Feb 6 | 5:00 pm – 6:00 pm PST
  • Chat with the Expert | Feb 6 | 6:00 pm – 8:30 pm PST
  • eFPGA Solutions for Flexible Die-to-Die Protocol Adapters, Nick Ilyadis | Feb 7 | 2:00 pm – 3:00 pm PST

Explore Our Solutions at Booth 306

  • Speedster®7t FPGAs: High-performance FPGAs with 2D network on chip, offering ASIC-level performance with full FPGA programmability.
  • Speedcore eFPGA IP: Over 15 million eFPGA IP cores shipped, providing performance and flexibility to ASICs and SoCs.
  • VectorPath® Accelerator Cards: PCIe accelerator cards featuring Speedster7t FPGAs for rapid prototyping and production, featuring 400G Ethernet interfaces, PCIe Gen 5.0, and 3.5 Tbps of GDDR6 memory bandwidth.

Meet with Achronix

Contact us to arrange a meeting or private demo. We are eager to discuss your project and demonstrate how Achronix can help you achieve your performance and go-to-market goals. Visit the Achronix Contact Page to schedule an appointment.

Discover plug-and-play FPGA-based chiplet connectivity and extend the ASIC lifespan with Achronix Speedcore eFPGA IP technology.