LinkedIn Live Webinar: The Rise of the Chiplet

By using an eFPGA-based chiplet, designers can realize many benefits.

Chiplet technology is on the rise

Although the idea of chiplets has existed for decades, chiplet-based packaging is driving new types of components, products, and systems for specialized applications. Some believe the future of chip innovation lies in moving to modular designs based on “chiplet” building blocks, essentially moving from system-on-chip (SoC) to System-on-Package (SoP) chip architectures. So, when will this happen? What are the benefits? And what will spur adoption? We talk about that, and more in this webinar with moderator, Brian Bailey (SemiEngineering), and panelists Nick Ilyadis (Achronix), Rich Wawrzyniak (Semico), and Bapi Vinnakota (ODSA).

What you’ll learn:

  • Current landscape & predictions
  • FPGA-based chiplets
  • Adoption & standardization

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About the Speaker(s)
Nick Ilyadis

Nick Ilyadis – Sr. Director of Product Planning

Nick is currently the Senior Director of Product Planning at Achronix. Prior to Achronix, Nick was VP of Portfolio and Technology Strategy at Marvell Semiconductor and Vice President and Group CTO at Broadcom. Nick has also held many engineering roles during his career, starting as a chip designer and moving up through management to lead both device and product engineering teams. Nick is passionate about technology and a prolific inventor with 72 issued patents across all aspects of wired and wireless communications.