Chiplet Summit 2025: Accelerating Time-to-Market Using a Hub and FPGA Chiplets

Event Start Date
Event End Date
Address
Santa Clara Convention Center
City
Santa Clara
State
CA

Achronix is excited to announce its role as a co-sponsor and presenter at the Chiplet Summit 2025, the premier event for innovators and leaders in chiplet-based design.

Achronix’s presentation in partnership with Primemas, Accelerating Time-to-Market Using a Hub and FPGA Chiplets will explore an innovative new chiplet architecture combining a versatile Hublet™ SoC chiplet with a programmable FPGA chiplet. This approach allows developers to build products on a single architecture, reducing the complexity and cost of customizing each variant. Key applications for this architecture include telecom, high-performance computing, AI/ML, cybersecurity, automotive, and defense.

  • Presentation Title: Accelerating Time-to-Market Using a Hub and FPGA Chiplets
  • Presentation Track: A-102: Design-1
  • Time: Wednesday, January 22, 2025
  • Presenters: Nick Ilyadis – Achronix, IL (Will) Park - Primemas

Achronix Chiplet Offering

Achronix will highlight its high-performance FPGAs and embedded FPGA (eFPGA) solutions that enable developers to design chiplets for system-in-package (SiP) solutions. These eFPGA chiplets offer reduced power consumption, smaller form factors, and optimized bandwidth, providing a flexible alternative for next-generation AI, machine learning, networking, and other advanced applications.

Event Overview

Chiplets have become a preferred option for developing several types of advanced silicon solutions. By partitioning chips into modular units, chiplets allow designers to reduce manufacturing costs, enhance scalability, and simplify the design process. Chiplet Summit 2025 will provide valuable insights into system-in-package (SiP) design, co-optimization techniques, and emerging applications like AI/ML and generative AI.

Who Should Attend

 This event is essential for chip designers, embedded system engineers, and innovators working on AI/ML, telecom, high-performance computing, and other next-gen silicon solutions. Attendees will gain insights into how chiplets and SiP technologies can streamline the design process, reduce costs, and bring products to market faster.

Join us at Chiplet Summit 2025 to discover how Achronix’s cutting-edge solutions are transforming chiplet-based design. Don’t miss this opportunity to connect with industry experts and learn how to build scalable, high-performance chips for future technologies.